面向太赫兹成像应用的硅基片上贴片天线阵列

    Silicon-based on-chip patch antenna array for terahertz imaging applications

    • 摘要: 随着太赫兹技术的发展,对片上成像系统的分辨率、集成度和功耗提出了更高的要求。片上天线技术是实现天线与电路一体化集成的关键途径,具有结构紧凑、可靠性高等优点。然而,片上天线面临着带宽窄和增益低等挑战,同时,对于太赫兹成像芯片而言,天线阵列构型与单元性能同等重要,需实现高增益、低耦合和旁瓣抑制。基于互补金属氧化物半导体工艺设计了面向太赫兹成像应用的片上贴片天线单元及阵列,通过加载缝隙实现了11.8%分数带宽的天线单元,天线阵列的增益达10.6 dBi,效率为21.9%。通过将太赫兹天线阵列与电路进行集成,实现了结构紧凑的太赫兹成像阵列芯片,收发阵列的辐射性能满足了太赫兹成像应用的需求。

       

      Abstract: With the development of terahertz technology, higher requirements have been placed on the resolution, integration, and power consumption of on-chip imaging systems. On-chip antenna technology was a crucial approach to realize the integration of antennas and circuits, it offered advantages such as compact structure and high reliability. However, on-chip antennas faced challenges such as narrow bandwidth and low gain. Meanwhile, for terahertz imaging chips, the configuration of antenna arrays was equally important as the performance of antenna elements, it necessitated the achievement of high gain, low coupling, and side-lobe suppression. This paper designed on-chip patch antenna elements and arrays for terahertz imaging applications based on complementary metal oxide semiconductor technology. By loading slots, we achieved antenna elements with a 11.8% fractional bandwidth, the gain of antenna arrays reached 10.6 dBi with the efficiency of 21.9%, it satisfied the demands of terahertz imaging applications. We integrated terahertz antenna arrays with circuits, a compact terahertz imaging array chip has been realized, whose radiation performance of the transceiver arrays meets the requirements for terahertz imaging applications.