星载太赫兹混频器装配工艺研究

    Assembly techniques research of terahertz mixer

    • 摘要: 随着技术的发展,太赫兹技术逐渐应用于航天领域,其中太赫兹混频器作为太赫兹固态收发前端的核心器件正在被各型号广泛应用。但目前我国200 GHz的星载太赫兹混频器应用与国外差距明显,亟须加大投入和发展。文章介绍了一种星载220 GHz混频器的装配技术,其具有设计指标严苛、结构复杂以及装配精度要求高的特点。文章根据产品的结构和电性能特点,采用细针粘附法、窄间隙低应力导电胶贴装法以及高精度金丝键合技术,实现了微米级太赫兹二极管高精度焊接(精度±10 μm),大尺寸高长宽比石英基板(2.24 mm×0.73 mm×0.127 mm)精密贴装,以及高精度、高一致性的金丝互联(跨度小于等于150 μm,拱高50 μm~100 μm)。组装完成的产品电性能结果与仿真结果基本一致,有效地解决了宇航用太赫兹混频器的装配难题。

       

      Abstract: With the development of techniques, terahertz devices have been gradually applied in space industry, where terahertz mixers serve as core components for transceivers and are being widely utilized across various satellite models. However, there is currently no application of satellite-borne terahertz mixer in China, indicating a noticeable gap compared to foreign counterparts, necessitating increased investment and development efforts. This paper introduces an assembly technology of satellite-borne 220 GHz mixer-characterized by stringent design requirements, complex structures, and high precision assembly demands. In this paper, according to the structural and electrical performance characteristics of the product, fine needle adhesion method, narrow-gap low-stress conductive adhesive mounting method and high-precision gold wire bonding technology are adopted to achieve high-precision soldering of micron-sized terahertz diodes (accuracy of ±10 μm), precision mounting of large-sized high-aspect-ratio quartz substrate (2.24 mm×0.73 mm×0.127 mm) and high-precision, high-conformity wire interconnections (span of ≤ 150 μm, arch height 50 μm ~100 μm). The electrical performance of the assembled product is basically consistent with the simulation results, effectively solving the assembly problem of terahertz mixers for aerospace applications.