Abstract: The miniaturization, integration, and lightweight design and manufacturing of laser terminals are inevitable trends in the development of optical communication technology. The emission module, as its core component, adopts high-precision optical coupling technology between active chips. Compared with traditional external lasers and fiber coupling, it has smaller volume, lighter weight, and higher integration. A simulation model for inter chip optical coupling based on aspherical lenses was established, and software was used for coupling simulation and analysis, providing theoretical values for coupling efficiency. A modular packaging structure between active chis was proposed, and the process design and implementation process were detailed from the aspects of module structure characteristics, chip heat dissipation, component packaging, chip interconnection, etc. The compliance of design simulation and the feasibility of modular packaging structure were verified through actual coupling packaging and testing. The successful research and verification of this project provides technical reference for high-precision optocoupling and packaging between active chip.