Abstract: This paper presents a V-band integrated transceiver Module for the Inter-Satellite Link. By integrating an up-conversion transmission chain, a down-conversion receiving chain, and a 3D-System-in-Package (3D-SIP) based local oscillator frequency source circuit, we have developed a multifunctional and miniaturized V-band transceiver module. The transmission link adopts a balanced power synthesis circuit topology based on a waveguide structure. The high-power output of the V-band RF signal reaches 39.5 dBm and the power added efficiency of the power synthesis circuit can reach 28%, with an Error Vector Magnitude (EVM) of only 8.9%. The receiver link adopts a one-time frequency conversion to achieve V-band RF input to S-band IF output, with a noise figure of only 4.3 dB. The two-stage automatic gain control (AGC) technology is employed, featuring a dynamic power adjustment range of up to 40 dB and an EVM value of 9.2%. The local oscillator frequency source utilizes a mixer-phase locked loop frequency synthesis circuit, delivering an ultra-low phase nosie of −93 dBc/Hz@10k Hz at 60.1 GHz, achieving ultra-low phase noise local oscillator output. In addition, 3D-SIP technology is adopted to achieve high-density stacked packaging of frequency source circuits, greatly reducing the overall size of components and solving the problem of miniaturization.