Abstract: With the development of miniaturization and integration of aerospace electronic products, ceramic colum grid array devices packaged with ceramic column gate array are more and more widely used in spaceborne products. However, there are some problems in the assembly process of ceramic colum grid array devices, such as difficulty in welding process , strict process control, etc. and slight errors in the control of each link , which are easy to cause problems such as virtual welding of single solder spot, crack and excessive porosity, resulting in the failure of normal use of devices, and even scrap of single board.Just because of the welding problem of ceramic colum grid array device, the whole board is scrapped, which not only seriously delays the development progress of the product, but also causes huge economic losses. According to the analysis of the usage of relevant units, CCGA-encapsulated chips are widely used in communication payload, data processing and control systems, and the annual usage is about 200~300 pieces. In the past five year ,about 10 pieces of scrapped devices have been scrapped due to repair ,resulting in economic lossesof up to millions of yuan. Through design of the ceramic columngate array packaging device planting column special tooling, carrier welding equipment ，successfully realized the device planting column, and the sample was tested and verified, which has a positive role in reducing product costs.