基于多层PCB的基板射频信号传输性能研究

    Research on the transmission performance of RF signal based on multilayer PCB

    • 摘要: 随着射频产品的小型化,特别是射频SIP(systems in package)产品的逐渐应用,基于多层PCB的基板射频组件等射频集成产品的应用越来越多,基板内射频信号传输性能的研究也越来越重要。通过对基于多层PCB的基板射频传输性能进行仿真测试,验证了DC-40GHz范围内射频基板传输性能,针对射频传输中极为关注的传输损耗问题,通过改进介质厚度或者铜箔材料实现基板射频传输损耗的优化,单位长度传输线射频传输损耗减小20%以上。同时针对星载等应用环境,通过深层充放电、总剂量试验,表明多层PCB的基板满足星载等航天应用。

       

      Abstract: With the miniaturization of RF products, especially the gradual application of RF SIP products. There are more and more applications of RF integrated products such as multilayer PCB substrate RF components. The research of RF signal transmission performance in the substrate is also becoming more and more important. In this paper, the RF performance of the substrate based on the multilayer PCB is simulated and tested. The transmission performance of the RF substrate in the DC-40GHz range has been verified. At the same time, for the extremely important transmission loss in the RF transmission performance, the optimization of the RF transmission loss is achieved by improved medium thickness or copper foil material, the transmission loss is reduced by more than 20%. According to the space application environment, through deep charge and discharge, total dose test, it is shown that the multilayer PCB substrate can meet the space application.