BAI Zhining, XIA Weijuan, HU Yuan, WANG Ping. A microwave module repair method that balances repair yield and efficiency[J]. Space Electronic Technology, 2025, 22(2): 121-126. DOI: 10.3969/j.issn.1674-7135.2025.02.014
    Citation: BAI Zhining, XIA Weijuan, HU Yuan, WANG Ping. A microwave module repair method that balances repair yield and efficiency[J]. Space Electronic Technology, 2025, 22(2): 121-126. DOI: 10.3969/j.issn.1674-7135.2025.02.014

    A microwave module repair method that balances repair yield and efficiency

    • With the continuous development of aerospace technology, aerospace microwave module products are developing towards miniaturization, densification and lightweight. The shell of silicon aluminum structure has been widely used in microwave module products. However, due to its own structure and material characteristics, there are great risks in various links of assembly. When the components are repaired in the assembly or debugging process, it is easy to cause damage to the surrounding devices, especially the devices close to the shell wall, which is difficult to repair and has a high risk of shell damage, thus putting forward higher requirements for the repair process.This paper analyzes the repair conditions and repair difficulties of space-borne microwave module products, designs special repair tools, improves the applicability of repair tools and the application of repair gaskets. It summarizes a repair technology that takes into account the repair yield and efficiency. It has been verified in the actual repair process, thus reducing the repair risk and effectively improving the repair efficiency and quality.
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