Research and application progresses of microwave system in package

Multi chip module is a representative technology in high-density electronic packaging technology, but due to the restrictions of microwave signal transmission in the package, its microwave chip adopts a horizontal arrangement method, which is difficult to meet the needs of high-frequency, high-density microwave system-level packaging. With the special substrate materials and advanced lamination production processes gradually expanding to the field of RF/microwave, the technology of RF/microwave components and antennas gradually shows a trend of wafer-level, three-dimensional and heterogeneous integration and other packaging integration. Microwave system in package as the most advanced technology has become one of the most effective solutions to increase system integration and achieve product miniaturization in the post-moore era. Through research, this paper summarizes the concept of microwave SiP, elaborates the difference between the characteristics of microwave SiP and other integration methods, and its classification according to architecture and substrate material, introduces the research progresses and challenges of SiP applied to the T/R modules of phased array antennas, lists domestic and foreign application examples, and expounds the design points and research directions of microwave SiP.